Factory Price Polystyrene Particle Thermal Insulation Mortar Rubber Powder - Hydroxypropyl Methyl Cellulose (HPMC) Used for Tile adhesives – MEVA
Factory Price Polystyrene Particle Thermal Insulation Mortar Rubber Powder - Hydroxypropyl Methyl Cellulose (HPMC) Used for Tile adhesives – MEVA Detail:
Better Workability
The shear-thinning and air-entraining properties of HPMC give modified tile adhesives a better workability, as well as higher work efficiency, from yield/coverage and faster tiling sequence stand points.
Improves Water Retention
We can improve water retention in tile adhesives. This helps increase final adhesion strength as well as prolong open time. Prolonged open time also leads to faster tiling rate as it allows the worker to trowel a larger area before setting the tiles down, as opposed to troweling the adhesive onto each tile before setting the tile down.
Provides Slip/Sag Resistance
Modified HPMC also provides slip/sag resistance, so that heavier or non-porous tiles do not slip down the vertical surface.
Increases Adhesion Strengths
As mentioned before, it allows the hydration reaction to complete farther, thus allowing higher final adhesion strength to develop
Note:Products can be customized according to customer needs.
Product detail pictures:
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We emphasize progress and introduce new merchandise into the market each and every year for Factory Price Polystyrene Particle Thermal Insulation Mortar Rubber Powder - Hydroxypropyl Methyl Cellulose (HPMC) Used for Tile adhesives – MEVA , The product will supply to all over the world, such as: Wellington, Southampton, Milan, Our company regards "reasonable prices, high quality,efficient production time and good after-sales service" as our tenet. We hope to cooperate with more customers for mutual development and benefits in future. Welcome to contact us.
By Martina from United Kingdom - 2018.12.25 12:43
We have worked with many companies, but this time is the best,detailed explanation, timely delivery and quality qualified, nice!
By Klemen Hrovat from Chile - 2018.06.28 19:27